About 簡介
高頻積體電路設計實驗室主要研究方向為設計並實現可應用於無線通訊與行動通訊系統收發機之射頻晶片,聚焦於通訊系統射頻前端的各個子電路,如低雜訊放大器、混頻器、壓控振盪器、濾波器、鎖相迴路等電路特性改善與優化,使其具備低功耗、低雜訊、高線性度、低成本等優點。加入本實驗室專題生與研究生所設計之電路,可經由國研院台灣半導體研究中心下線實作晶片與參數量測。專題生與研究生在參與積體電路設計過程中,可獲得許多無線通訊與行動通訊系統之晶片設計實務經驗,具備射頻通訊積體電路設計之專業能力,未來將成為行動通訊產業不可或缺之人才。
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No. 1, Sec. 2, Da Hsueh Rd. Shoufeng, Hualien 974301, Taiwan, R.O.C.
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College of Engineering II, C213 Room
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TEL:+886-3-8905071
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FAX:+886-3-8900169
Our main research interest lies in the design and development of high-frequency integrated circuits used in the radio frequency transceivers for wireless communication and mobile communication systems. The front-end of wireless communication system includes several sub-circuits, such as low-noise amplifiers, mixers, voltage-controlled oscillators, filters, phase-locked loops, etc. It is important to design the receivers and transmitters to obtain the advantages of low power consumption, low noise, and high linearity etc. Through taking courses and chip tape-out by Taiwan Semiconductor Research Institute, students who join our RFIC design laboratory can be trained to have the professional ability of high frequency communication integrated circuit design. During participating in the research, students can gain a lot of practical experience in chip design for wireless and mobile communication systems. They will become indispensable research talents in the future mobile communication industry.